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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HN200209 Issued Date : 2000.11.01 Revised Date : 2002.10.25 Page No. : 1/3 HMBTA94 PNP EPITAXIAL PLANAR TRANSISTOR Description The HMBTA94 is designed for application that requires high voltage. Features * High Breakdown Voltage: VCEO=400(Min.) at IC=1mA * Complementary to HMBTA44 SOT-23 Absolute Maximum Ratings * Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 C Junction Temperature .................................................................................... +150 C Maximum * Maximum Power Dissipation Total Power Dissipation (Ta=25C) ................................................................................ 350 mW * Maximum Voltages and Currents (Ta=25C) VCBO Collector to Base Voltage ...................................................................................... -400 V VCEO Collector to Emitter Voltage ................................................................................... -400 V VEBO Emitter to Base Voltage ............................................................................................. -6 V IC Collector Current ...................................................................................................... -150 mA Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICES *VCE(sat)1 *VCE(sat)2 *VCE(sat)3 *VBE(sat) *hFE1 *hFE2 *hFE3 *hFE4 Cob Min. -400 -400 -6 50 75 60 40 Typ. 4 Max. -100 -100 -500 -200 -300 -600 -900 200 6 Unit V V V nA nA nA mV mV mV mV Test Conditions IC=-100uA, IE=0 IC=-1mA, IB=0 IE=-10uA, IC=0 VCB=-400V, IE=0 VEB=-6V, IC=0 VCE=-400V, VBE=0 IC=-1mA, IB=-0.1mA IC=-10mA, IB=-1mA IC=-50mA, IB=-5mA IC=-10mA, IB=-1mA VCE=-10V, IC=-1mA VCE=-10V, IC=-10mA VCE=-10V, IC=-50mA VCE=-10V, IC=-100mA VCE=-10V, f=1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% pF HMBTA94 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 1000 hFE @ VCE=10V o Spec. No. : HN200209 Issued Date : 2000.11.01 Revised Date : 2002.10.25 Page No. : 2/3 Current Gain & Collector Current 75 C 125 C 100 25 C o o o o 75 C 125 C hFE hFE 100 25 C o 10 hFE @ VCE=3V 1 1 10 100 1000 10 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Saturation Voltage & Collector Current 1000 VCE(sat) @ IC=10IB 1000 Saturation Voltage & Collector Current 25 C o Saturation Voltage (mV) Saturation Voltage (mV) 75 C o 125 C o 125 C o 75 C o 100 25 C o VBE(sat) @ IC=10IB 10 1 10 100 Collector Current-IC (mA) 1000 100 1 10 100 1000 Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage 100 Capacitance (pF) 10 Cob 1 0.1 1 10 100 Reverse-Biased Voltage (V) HMBTA94 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. SOT-23 Dimension Spec. No. : HN200209 Issued Date : 2000.11.01 Revised Date : 2002.10.25 Page No. : 3/3 A L Marking: 3 BS 1 V G 2 4Z Rank Code Control Code 3-Lead SOT-23 Plastic Surface Mounted Package HSMC Package Code: N C D H K J Style: Pin 1.Base 2.Emitter 3.Collector *: Typical DIM A B C D G H Inches Min. Max. 0.1102 0.1204 0.0472 0.0630 0.0335 0.0512 0.0118 0.0197 0.0669 0.0910 0.0005 0.0040 Millimeters Min. Max. 2.80 3.04 1.20 1.60 0.89 1.30 0.30 0.50 1.70 2.30 0.013 0.10 DIM J K L S V Inches Min. Max. 0.0034 0.0070 0.0128 0.0266 0.0335 0.0453 0.0830 0.1083 0.0098 0.0256 Millimeters Min. Max. 0.085 0.177 0.32 0.67 0.85 1.15 2.10 2.75 0.25 0.65 Notes: 1.Dimension and tolerance based on our Spec. dated Sep. 07,1997. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HMBTA94 HSMC Product Specification |
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